US Patent Issued to SAMSUNG ELECTRONICS on Oct. 6 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,790, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the same" was invented by Yeongseon Kim (Suwon-si, South Korea), Dohyun Kim (Suwon-si, South Korea), Juhyeon Kim (Suwon-si, South Korea), Hyoeun Kim (Suwon-si, South Korea), Seonkyung Seo (Suwon-si, South Korea) and Chajea Jo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip including a first semiconductor device, a second semiconductor chip including a second semiconductor device, and a bonding structure between the first and sec...