US Patent Issued to SAMSUNG ELECTRONICS on Oct. 6 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,763, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package" was invented by Cheol Kim (Suwon-si, South Korea), Seokhyun Lee (Suwon-si, South Korea), Seokgeun Ahn (Suwon-si, South Korea) and Hwanyoung Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first redistribution structure including a top surface, a chip arranged on the top surface of the first redistribution structure the chip having a top surface, bottom surface, and side surfaces, and a package body arranged on the top surface of the first redistribution structure to cover th...