US Patent Issued to SAMSUNG ELECTRONICS on Oct. 6 for "Conditioner and chemical mechanical polishing apparatus including the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,752,393, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Conditioner and chemical mechanical polishing apparatus including the same" was invented by Yeonsu Go (Suwon-si, South Korea) and Donghoon Kwon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a conditioner including a conditioning arm on a polishing pad that is configured to chemically mechanically polish a substrate based on slurry, a conditioning disk on the conditioning arm that is configured to condition the polishing pad, a dilution solution injector on a first side of the conditioning arm and configured to inject a dil...