US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Systems and methods for transmitting and receiving double data rate (DDR) physical (PHY) interface (DFI) signals using universal chiplet interconnect express (UCIe)" (California Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,775,564, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Systems and methods for transmitting and receiving double data rate (DDR) physical (PHY) interface (DFI) signals using universal chiplet interconnect express (UCIe)" was invented by Jonghyeon Kim (San Jose, Calif.) and Chang Jun Kim (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method for transmitting and receiving DFI signals using UCIe, the method including receiving, from a memory controller of a first die, a first DFI signal via a first controller-side DFI channel, the first controller-side DFI channel being one of at l...