US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Semiconductor package with stepped redistribution structure exposing mold layer" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,947, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package with stepped redistribution structure exposing mold layer" was invented by Inhyung Song (Cheonan-si, South Korea), Kyoung Lim Suk (Suwon-si, South Korea), Jaegwon Jang (Hwaseong-si, South Korea) and Wonkyoung Choi (Anyang-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor device on a first redistribution substrate, a first mold layer that covers the first semiconductor device and the first redistribution substrate, and a second redistribution substrate on the first mol...