US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Semiconductor package and wiring substrate included in the same" (South Korean Inventor)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,948, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and wiring substrate included in the same" was invented by Kang Joon Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package according to an embodiment includes a semiconductor chip, and a redistribution portion electrically connected to the semiconductor chip. The redistribution portion includes an inner insulation layer, an interconnection pad, and an outer insulation layer. The interconnection pad is on the inner insulation layer and includes a first region and a second region outside the f...