US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,952, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package and method of manufacturing the semiconductor package" was invented by Hwanjoo Park (Suwon-si, South Korea), Sunggu Kang (Suwon-si, South Korea) and Jaechoon Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first redistribution wiring layer having first redistribution wirings; a first lower semiconductor chip and a second lower semiconductor chip spaced apart from each other on the first redistribution wiring layer; a sealing member covering the first lower semiconductor c...