US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Semiconductor package and manufacturing method for the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,949, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and manufacturing method for the same" was invented by Hyunsoo Chung (Suwon-si, South Korea), Kwang-Soo Kim (Suwon-si, South Korea) and Chi Woo Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a redistribution layer structure, a first sub-package positioned on the redistribution layer structure, a second sub-package positioned on the first sub-package, and a first encapsulant positioned on the first sub-package and encapsulating the second sub-package. The first sub-package inc...