US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,985, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package" was invented by Jihyun Lim (Suwon-si, South Korea) and Yoonyoung Jeon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package including a first wiring structure, a second wiring structure disposed on the first wiring structure, an expanded layer electrically connecting the first wiring structure and the second wiring structure to each other, and including an expanded base layer and a plurality of via structures, a semiconductor chip disposed in the expanded layer and between the first...