US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,926, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-Do, South Korea).

"Semiconductor package" was invented by Geunwoo Kim (Suwon-si, South Korea) and Kyung Don Mun (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first redistribution substrate, a first semiconductor chip on the first redistribution substrate, a heat dissipation layer on the first semiconductor chip and in contact with an upper surface of the first semiconductor chip, a second redistribution substrate on the heat dissipation layer, a molding layer surrounding the first semiconductor chip and the heat d...