ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,907, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Sunkyoung Seo (Cheonan-si, South Korea), Chajea Jo (Yongin-si, South Korea), Yeongseon Kim (Suwon-si, South Korea), Juhyeon Kim (Cheonan-si, South Korea) and Hyoeun Kim (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A first semiconductor chip includes a first semiconductor substrate, a first wiring structure arranged on the first semiconductor substrate, a plurality of through electrodes penetrating through at least a portion of the first semiconductor substrate, and a plurality of first bondi...