ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,953, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package" was invented by Jae-Min Jung (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a substrate including a chip region and an edge region extending around the chip region; a plurality of film wirings on the substrate in the chip region; an input wiring and an output wiring on the substrate in the edge region and extending to the chip region in a direction parallel to an upper surface of the substrate; and a semiconductor chip on the substrate in the chip region and electrically connec...