US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Semiconductor device and method of manufacturing the semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,935, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device and method of manufacturing the semiconductor device" was invented by Myoungsoo Kim (Suwon-si, South Korea) and Jisung Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate including a circuit region and a protection region surrounding the circuit region, a plurality of insulating layers sequentially provided on the substrate, a moisture blocking structure extending in the plurality of insulating layers in the protection region of the substrate and surrounding the circuit ...