US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Semiconductor device, method for manufacturing the same, and electronic system including semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,653, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device, method for manufacturing the same, and electronic system including semiconductor device" was invented by Wonjun Park (Suwon-si, South Korea), Byongju Kim (Suwon-si, South Korea), Jaemin Jung (Suwon-si, South Korea), Kwangmin Park (Suwon-si, South Korea), Donghwa Lee (Suwon-si, South Korea) and Dongsung Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate; a stack structure including an interlayer insulating layer and a gate electrode which are alternately stacked on the...