US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Method of splitting semiconductor chip using mechanical machining and semiconductor chip split by the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,894, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Method of splitting semiconductor chip using mechanical machining and semiconductor chip split by the same" was invented by Yeongkwon Ko (Suwon-si, South Korea), Seunghun Shin (Suwon-si, South Korea), Jihun Jung (Suwon-si, South Korea) and Junyeong Heo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provide is a method of splitting a semiconductor chip, the method including performing a back-end-of-line (BEOL) process including forming a plurality of chip areas on a semiconductor substrate, forming a splitting area, which separates th...