ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,931, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Chip-on-film package" was invented by Minwoo Cho (Suwon-si, South Korea) and Seunghyun Cho (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to chip-on-film packages. An example chip-on-film package comprises a base film including a first surface and a second surface opposite to the first surface. The base film includes a protection layer adjacent to the first surface, a film substrate adjacent to the second surface, a plurality of lead lines between the film substrate and the protection layer, and a bondi...