US Patent Issued to SAMSUNG ELECTRONICS on Oct. 20 for "Substrate bonding apparatus and method of manufacturing semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,778, issued on Oct. 20, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Substrate bonding apparatus and method of manufacturing semiconductor device using the same" was invented by Sehoon Jang (Suwon-si, South Korea), Inhwa Baek (Suwon-si, South Korea), Hyungku Kim (Suwon-si, South Korea), Kibum Yu (Suwon-si, South Korea), Jaesung Yun (Suwon-si, South Korea), Yongin Lee (Suwon-si, South Korea), Jaehyuk Jung (Suwon-si, South Korea), Gwanghee Jo (Suwon-si, South Korea) and Youngjin Cho (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate bonding apparatus may include a first bonding chuck includin...