US Patent Issued to SAMSUNG ELECTRONICS on Oct. 20 for "Semiconductor package including an adhesive structure" (South Korean Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,462, issued on Oct. 20, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including an adhesive structure" was invented by Jooyoung Oh (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, where a plurality of bonding pads are arranged on an upper surface of the package substrate; a semiconductor chip mounted on the upper surface of the package substrate, where a plurality of chip pads are arranged on an upper surface of the semiconductor chip; a first adhesive film attached to a lower surface of the semiconductor chip, wherein the first ...