US Patent Issued to SAMSUNG ELECTRONICS on Oct. 20 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,461, issued on Oct. 20, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of fabricating the same" was invented by Hyeongwoo Jin (Suwon-si, South Korea) and Myoungchul Eum (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package and a method of fabricating the same. The semiconductor package includes a lower structure including a first lower conductive pad disposed on an upper surface thereof, a first semiconductor chip disposed on the lower structure, the first semiconductor chip including a first chip conductive pad disposed on a lower surface thereof, a sol...