US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor package having an antenna pattern on a mold layer" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,790, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package having an antenna pattern on a mold layer" was invented by Yongjin Seol (Seongnam-si, South Korea), Seonhyang You (Hwaseong-si, South Korea), Wonjae Lee (Yongin-si, South Korea) and Wooik Jang (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, a semiconductor chip on the package substrate, a mold layer on the package substrate to cover the semiconductor chip, the mold layer having a first side surface and a first trench disposed at the first side surface, and the firs...