US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor package and substrate for semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,830, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package and substrate for semiconductor package" was invented by Jin Mo Kwon (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is provided. A semiconductor package includes a semiconductor package comprising a connecting structure in which a connecting terminal is placed in a lower part, and a semiconductor chip which is placed on the connecting structure and connected to the connecting structure, wherein the connecting structure includes a plurality of wiring layers placed to be stacked, a plural...