US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,770, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of fabricating the same" was invented by Cheol Kim (Suwon-si, South Korea), Hyoeun Kim (Suwon-si, South Korea) and Huiyeong Jang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a first semiconductor chip, a second semiconductor chip on a top surface of the first semiconductor chip and having a width less than that of the first semiconductor chip, and a molding layer on the first semiconductor chip and ...