ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,875, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Dongkyu Kim (Suwon-si, South Korea), Kyung Don Mun (Suwon-si, South Korea), Kyoung Lim Suk (Suwon-si, South Korea) and Hyeonjeong Hwang (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a semiconductor package comprising a lower circuit part having a first region and a second region horizontally offset from each other and including a connection structure within the first region and a logic chip within the second region, a memory structure that overlaps the connection structure in a verti...