ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,874, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package" was invented by Wonjung Jang (Suwon-si, South Korea) and Jungseok Ahn (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The reliability of stacked semiconductor packages may be improved via a semiconductor package including a first semiconductor chip including through silicon vias (TSVs) with respective upper conductive pads electrically connected to the TSVs, a second semiconductor chip on the first semiconductor chip with lower conductive pads on a lower surface of the second semiconductor chip, conductive bumps b...