ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,871, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Nara Lee (Suwon-si, South Korea), Yeonjin Lee (Suwon-si, South Korea), Jimin Choi (Suwon-si, South Korea) and Jongmin Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a plurality of first semiconductor chips sequentially stacked, each of the first semiconductor chips including a circuit layer on a first surface of a first substrate, a through-silicon via passing through the first substrate, and a bump pad connected to the through-silicon via, and a second semicon...