US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,807, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package" was invented by Joonghyun Baek (Suwon-si, South Korea), Hyunsoo Chung (Suwon-si, South Korea) and Seok-Hong Kwon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first redistribution layer, a first semiconductor chip, and a second semiconductor chip. The first redistribution layer includes a first intervening interconnection layer and a first upper interconnection layer. The first intervening interconnection layer includes a first intervening insulating layer, a first intervening ...