US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,820, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package" was invented by Keunho Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a first redistribution structure having a structure including at least one first redistribution layer and at least one first insulating layer; a first semiconductor chip disposed on the first redistribution structure; a second semiconductor chip disposed on the first redistribution structure; and bumps disposed between the first redistribution structure and the first semiconductor chip and between the firs...