ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,798, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Method of fabricating semiconductor package" was invented by Junghoon Kang (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a semiconductor package is disclosed. The method may include providing an insulating layer, forming a seed layer to cover a top surface of the insulating layer, forming a sacrificial layer on the seed layer, forming penetration holes to penetrate the sacrificial layer and expose the seed layer, forming conductive posts in the penetration holes, removing the sacrificial layer, performing a las...