US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Manufacturing method of semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,779,836, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Manufacturing method of semiconductor package" was invented by YongChul Shin (Suwon-si, South Korea), Minwoo Rhee (Suwon-si, South Korea), Sujie Kang (Suwon-si, South Korea), Sun-woo Park (Suwon-si, South Korea), Nungpyo Hong (Suwon-si, South Korea) and Kyeongbin Lim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package manufacturing method includes: bonding a carrier to a wafer; dicing the wafer together with the carrier which is bonded to the wafer into a plurality of die-carrier assemblies, each of the plurality of ...