US Patent Issued to SAMSUNG ELECTRONICS on May 5 for "Three-dimensional semiconductor memory device, electronic system including the same, and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,621,993, issued on May 5, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Three-dimensional semiconductor memory device, electronic system including the same, and method of fabricating the same" was invented by Jaeryong Sim (Suwon-si, South Korea), Donghyuck Jang (Hwaseong-si, South Korea) and Jeehoon Han (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are 3D semiconductor memory device, electronic systems including the same, and methods of fabricating the same. The 3D semiconductor memory device includes lower selection lines extending in a first direction on a substrate and spaced apart from each...