ALEXANDRIA, Va., May 5 -- United States Patent no. 12,620,564, issued on May 5, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor substrate processing apparatus" was invented by Daewoong Heo (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor substrate processing apparatus includes a chamber dimensioned to accommodate a plurality of strip magazines, each strip magazine configured to receive a plurality of substrates therein, a plasma generator coupled to the chamber and configured to generate plasma used to remove foreign substances on the substrates in the chamber, and a rotation support mechanism configured to rotate the plurality of stri...