US Patent Issued to SAMSUNG ELECTRONICS on May 5 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,622,000, issued on May 5, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the semiconductor package" was invented by Younghun Cheong (Suwon-si, South Korea), Minchul Cho (Suwon-si, South Korea) and Cheolsoo Han (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, a plurality of first semiconductor chips stacked on an upper surface of the package substrate in a stair-step configuration, the plurality of first semiconductor chips having an uppermost semiconductor chip at a first height from the upper surface of the ...