US Patent Issued to SAMSUNG ELECTRONICS on May 5 for "Circuit board having electromagnetic shielding structures and electronic device including the same" (South Korean Inventor)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,621,925, issued on May 5, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Gyeonggi-Do, South Korea).

"Circuit board having electromagnetic shielding structures and electronic device including the same" was invented by Cheuk Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board electrically connected to an electronic device includes a base layer, a first conductive layer on a first surface of the base layer, a second conductive layer on a second surface of the base layer and including a terminal portion which is exposed outside of the circuit board and at which the circuit board is electrically connected to the electronic...