ALEXANDRIA, Va., May 26 -- United States Patent no. 12,639,504, issued on May 26, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Semiconductor device and method of fabricating the same" was invented by Seong-Yul Park (Hwaseong-si, South Korea) and Youngdoo Jeon (Seongnam-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a semiconductor device may include designing a layout including first and second gate patterns, first and second dummy gate patterns, and third and fourth gate patterns sequentially arranged in a first direction; forming first to fourth sacrificial patterns and first and second dummy sacrificial patterns, which correspond to the ...