ALEXANDRIA, Va., May 26 -- United States Patent no. 12,637,761, issued on May 26, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Method of densifying plasma-resistant coating layer" was invented by Naeun Lee (Suwon-si, South Korea), Shinhwa Jung (Suwon-si, South Korea), Sanghee Lee (Suwon-si, South Korea), Wonhee Lee (Suwon-si, South Korea) and Donghyun Jang (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of densifying a plasma-resistant coating layer includes applying a fluorocarbon material including CxHyFz (where x and z are each independently a real number greater than 0, and y is an integer greater than or equal to 0) to a surface of a base material...