ALEXANDRIA, Va., May 26 -- United States Patent no. 12,637,486, issued on May 26, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Ligands for nano-sized materials" was invented by Itai Lieberman (Oud-Heverlee, Belgium), Manuel Hamburger (Mannheim, Germany), Christian Matuschek (Frankfurt am Main, Germany), Thomas Eberle (Landau, Germany), Beate Burkhart (Darmstadt, Germany) and Sebastian Meyer (Frankfurt am Main, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a compound suitable as ligand for binding to the surface of a semiconductor nanoparticle, said compound comprising an anchor group, a linker group and an organic functional group; a semicon...