ALEXANDRIA, Va., May 19 -- United States Patent no. 12,629,728, issued on May 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Gyeonggi-Do, South Korea).
"Wafer cleaning apparatus" was invented by Jieun Seo (Suwon-si, South Korea) and Donghoon Kwon (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer cleaning apparatus including a rotating plate configured to support a wafer thereon, and a cleaning unit above the rotating plate and configured to spray cleaning water, wherein the cleaning unit includes a body, a nozzle in the body, at least one supply pipe connected to the nozzle and configured to supply a cleaning substance, and a discharge member at a lower end portion of the nozzl...