US Patent Issued to SAMSUNG ELECTRONICS on May 19 for "Semiconductor packages" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,580, issued on May 19, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor packages" was invented by Changeun Joo (Suwon-si, South Korea), Ohguk Kwon (Suwon-si, South Korea) and Sunjae Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package may include a first redistribution substrate, a second redistribution substrate on the first redistribution substrate, a chip stack between the first redistribution substrate and the second redistribution substrate, a first molding layer on the chip stack, and a through electrode extending into the first molding layer and electrically conne...