US Patent Issued to SAMSUNG ELECTRONICS on May 19 for "Semiconductor devices and data storage systems having a plurality of interconnected peripheral vias" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,138, issued on May 19, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor devices and data storage systems having a plurality of interconnected peripheral vias" was invented by Donghoon Kwon (Hwaseong-si, South Korea), Chungki Min (Hwaseong-si, South Korea) and Kihoon Jang (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a first substrate; a second substrate including first and second regions; a stack structure in the first region and extending from the first region into the second region, the stack structure including interlayer insulating layers and gate laye...