ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,616, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Wafer chuck table and wafer chuck system" was invented by Jonggu Lee (Seoul, South Korea), Sunghyup Kim (Hwaseong-si, South Korea), Jeongdu Kim (Seoul, South Korea), Hyeonjin Kim (Seoul, South Korea) and Junghwan Kim (Bucheon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer chuck table includes a center plate having a plurality of first protrusions each having an upper end at least partially defining a first reference plane, segmented plates arranged around the center plate and having a plurality of second protrusions, each having an up...