US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Semiconductor package having two-dimensional input and output device" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,709, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package having two-dimensional input and output device" was invented by Kyungsoo Kim (Suwon-si, South Korea) and Kyenhee Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is provided. The semiconductor package includes: a first semiconductor chip including a first bonding structure; a first front-end level layer including a first integrated circuit device; a first sub-back-end level layer including a plurality of first metal wire layers, an input and output device level layer including a two-dimensio...