US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Semiconductor package having protrusions from redistribution wiring layer and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,712, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package having protrusions from redistribution wiring layer and method of manufacturing the semiconductor package" was invented by Jaekyung Yoo (Suwon-si, South Korea), Woohyeong Kim (Suwon-si, South Korea), Jinwoo Park (Suwon-si, South Korea), Juhyeon Oh (Suwon-si, South Korea) and Jayeon Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first redistribution wiring layer having a first surface and a second surface opposite to the first surface, the first redistribution wiring layer hav...