US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,707, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the semiconductor package" was invented by Byungwook Kim (Suwon-si, South Korea), Ayoung Kim (Yongin-si, South Korea), Seongwon Jeong (Seoul, South Korea) and Sangsu Ha (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate having a first surface and a second surface opposite to the first surface, and including a plurality of bonding pads exposed to the first surface and a plurality of solder bumps respectively disposed on the bonding pads, a...