US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,708, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package and method of manufacturing the same" was invented by Jeongho Lee (Suwon-si, South Korea) and Doohwan Lee (Asan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a redistribution portion including an insulating layer, a redistribution layer, and a redistribution via, an under-bump metallurgy (UBM) layer below the redistribution portion and including a UBM pad on a lower surface of the redistribution portion and a UBM via on the UBM pad to penetrate through the insulating layer, a semicond...