US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,684, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package" was invented by Jeonghyun Lee (Seoul, South Korea), Hwanpil Park (Hwaseong-si, South Korea), Jongbo Shim (Asan-si, South Korea), Eunsu Lee (Suwon-si, South Korea) and Jangwoo Lee (Asan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a redistribution structure having a first surface, an opposite second surface, and a redistribution layer between the first surface and the second surface. A semiconductor chip is on the first surface of the redistribution structure and is electrically connect...