US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Integrated circuit package, electronic device including the same, and manufacturing method thereof" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,711, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Integrated circuit package, electronic device including the same, and manufacturing method thereof" was invented by Taeyang Na (Suwon-si, South Korea), Kicheol Bae (Suwon-si, South Korea) and Chulwoo Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the disclosure relate to an integrated circuit package, an electronic device including same, and a manufacturing method therefor, the method comprising: attaching at least one first element to a first surface of a substrate; molding the first surface using a first m...