US Patent Issued to SAMSUNG ELECTRONICS on March 31 for "Wafer inspection apparatus using three-dimensional image and method of inspecting wafer using the same" (South Korean Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,900, issued on March 31, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Wafer inspection apparatus using three-dimensional image and method of inspecting wafer using the same" was invented by Yusin Yang (Seoul, South Korea), Sungyoon Ryu (Seoul, South Korea) and Younghoon Sohn (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer inspection apparatus includes: a stage configured such that a wafer is arranged on the stage; an optical apparatus configured to align the wafer on the stage and generate an optical intensity image including an optical intensity profile; a focus adjusting unit configured to alig...