US Patent Issued to SAMSUNG ELECTRONICS on March 31 for "Substrate processing apparatus and substrate processing method using the same" (South Korean Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,592,366, issued on March 31, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate processing apparatus and substrate processing method using the same" was invented by Hakyoung Kim (Bucheon-si, South Korea), Minyoung Hur (Hwaseong-si, South Korea), Sumin Park (Yongin-si, South Korea) and Daehyun Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are substrate processing apparatuses and methods. The substrate processing apparatus comprises a chuck that supports a substrate, an insulator ring that surrounds the chuck, a focus ring on the insulator ring, and a ground ring outside the insulator ri...