US Patent Issued to SAMSUNG ELECTRONICS on March 31 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,702, issued on March 31, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and method of fabricating the same" was invented by Hyunsu Hwang (Siheung-si, South Korea), Junyun Kweon (Cheonan-si, South Korea), Jumyong Park (Cheonan-si, South Korea), Jin Ho An (Seoul, South Korea), Dongjoon Oh (Suwon-si, South Korea), Chungsun Lee (Anyang-si, South Korea) and Ju-il Choi (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are semiconductor packages and methods of fabricating the same. The semiconductor package includes a redistribution substrate including redistribution line patte...