US Patent Issued to SAMSUNG ELECTRONICS on March 31 for "Semiconductor device with two-phase cooling structure including ultrasonic transducer" (South Korean Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,691, issued on March 31, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device with two-phase cooling structure including ultrasonic transducer" was invented by Daehyuk Son (Suwon-si, South Korea), Sungchan Kang (Suwon-si, South Korea) and Seogwoo Hong (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor chip including a semiconductor integrated circuit, and a cooling channel formed in the semiconductor chip and providing a moving path for a coolant. An ultrasonic vibrator may be arranged in the cooling channel. The ultrasonic vibrator may vibrate...